Today all the EDSFF family of form factors share the same protocol (NVMe), the same interface (PCIe), the same edge connector (SFF-TA-1002), and the same pinout and functions (SFF-TA-1009). There is a vast diversity of Enterprise and Datacenter applications. This presentation, from the 2020 OCP Summit, explains how having a flexible and scalable family of form factors allows for optimization for different use cases, different media types on SSDs, scalable performance, and improved data center TCO. the specification.

This FMS panel moderated by Cameron Brett, SNIA SSD SIG Co-Chair with panelists Jonmichael Hands (Chia Network), Trent Johnson (IBM), Don Jeanette (TrendFocus), Bill Lynn (AMD), and Paul Kaler (HPE), provided an update of the latest E1 and E3 innovations and how having a flexible and scalable family of form factors allows for optimization for different use cases, different media types on SSDs, scalable performance, and improved data center TCO.

Learn how having a flexible and scalable family of form factors allows for optimization for different use cases, different media types on SSDs, scalable performance, and improved data center TCO. We will highlight the latest SNIA specifications that support these form factors, provide an overview of platforms that are EDSFF-enabled, and discuss the future for new product and application introductions.